首页师资队伍师资队伍Z
张勇 Yong Zhang

个人简介

 张勇(教授),生于1982年,山东省淄博市。于20156月加入格莱特纳米科技研究所和材料科学与工程学院卢柯院士研究团队。张勇博士于20107月在中国科学院金属研究所获得材料学博士学位,师从卢柯院士和陶乃镕研究员,2010920139月在美国约翰霍普金斯大学机械工程系从事博士后研究,20139 20155月在美国约翰霍普金斯大学机械工程系和极端环境材料研究所担任研究科学家。张勇博士在卢柯院士研究团队主要从事极端环境材料的设计和使役行为研究。到目前为止在ActaMaterialia, ScriptaMaterialia, Applied Physics Letters, Advanced Functional Materials等期刊发表文章十余篇,文章被引用400余次。欢迎优秀本科生、硕士生和博士生加盟本课题组。

联系方式:yong@njust.edu.cn,电话:15805197931,办公室:340221

教育背景

 2004.09 - 2010.6   中国科学院金属研究所 博士

2000.09 - 2004.06      南京理工大学     学士

工作履历

 2015.06-至今    南京理工大学 格莱特纳米科技研究所、材料科学与工程学院

教授

2013.09-2015.05 美国约翰霍普金斯大学 机械工程系、极端环境材料研究所

研究科学家

2010.09-2013.09 美国约翰霍普金斯大学机械工程系博士后

学术/社会兼职

美国矿物、金属和材料学会(TMS)会员

ScriptaMaterialia, Intermetallics,Materials Research Letters, Science of AdvancedMaterials, Journal of Materials Science, Materials Science and Engineering A, Materials & Design, Materials Letters, Materials Characterization, Materials Letters, Journal of Materials Processing Technology, Journal ofMaterials Research, Engineering Fracture Mechanics, Metallurgical and MaterialsTransactions B, Journal of Materials Science & Technology, ActaMechanicaSinica,International Journal of Cast Metals Research,Engineering Fracture Mechanics 审稿人 

研究领域/概况

 研究兴趣主要集中在极端环境材料的设计和使役行为研究,具体包括:

1.纳米结构材料的强化和增韧机制研究

2.基于变形机制的镍基合金材料的高温力学行为调控

3.极端环境下的材料使役行为研究

4.轻质三维点阵材料的设计、制备和表征

奖励与荣誉

 2011 ActaMaterialia 2006-2010中国大陆作者引用前50 (ActaMaterialia Top 50 Highly Cited Articles By Chinese Mainland Authors 2006-2010)

2010中国科学院朱李月华奖学金

学术成果

 专利

1.ThreeDimentional Woven Lattices as Multi-Functional Heat Exchanger, US Patent/62165373.

2.Combining Complex Flow Manfold with Three Dimensional Woven Lattices as A Thermal Management Unit, US Patent/62165383.

3.一种利用严重塑性变形制备高强度高导电铜薄板的方法”,ZL200710011723.1, 2010.05.19.

代表论文

1. Y. Zhang, S. Ha, K. Sharp, J.K. Guest, T.P. Weihs, K.J. Hemker, “Fabrication and mechanical characterization of 3D woven Cu lattice materials”, Materials & Design, 85(2015)743-751.

2. W.G. Huang, K. Besar, Y. Zhang, S. Yang, G. Wiedman, Y. Liu, W.M. Guo, J. Song, K.J. Hemker, K. Hristova, I.J. Kymissis, H.E. Katz, “A High-capacitance salt-free dielectric for self-healable, printable, and flexible organic field effect transistors and chemical sensor”, Advanced Functional Materials 25 (2015) 3745-3755.

3. L.Y. Zhao, S. Ha, K. Sharp, A.B. Geltmacher, R.W. Fonda, A. Kinsey, Y. Zhang, S. Ryan, D. Erdeniz, D.C. Dunand, K.J. Hemker, J.K. Guest, T.P. Weihs, “Permeability Measurements and Modeling of Topology-optimized Metallic 3D Woven Lattices”, ActaMaterialia, 81 (2014) 326-336.

4. J.A. Sharon, Y. Zhang, F. Mompiou, M. Legros, K.J. Hemker, “Discerning Size Effect Strengthening in Ultra-fine Grain Mg Thin Films”, ScriptaMaterialia, 75 (2014) 10-13.

5. D.E. Burns, Y. Zhang, T.P. Weihs, K.J. Hemker, “Properties of Sputter Deposited Ni-base Superalloys for Microelectromechanical Systems”, Thin Solid Films 558 (2014) 20-23.

6. Y. Zhang, J.A. Sharon, G.L. Hu, K.T. Ramesh, K.J. Hemker, “Stress-driven Grain Growth in   Ultrafine-grained Mg Thin Film”, ScriptaMaterialia, 68 (2013) 424-427.

7. D.E. Burns, Y. Zhang, M. Teutsch, K. Bade, J. Aktaa, K.J. Hemker, “Development of Ni-based Superalloys for Microelectromechanical Systems”, ScriptaMaterialia, 67 (2012) 459-462.

8. Y. Zhang, N.R. Tao, K. Lu, “Effects of Stacking Fault Energy, Strain Rate and Temperature on Microstructure and Strength of Nanostructured Cu-Al Alloys Subjected to Plastic Deformation”, ActaMaterialia, 59 (2011) 6048-6058.

9. Y. Zhang, N.R. Tao, K. Lu, “Effect of Stacking-fault Energy on Deformation Twin Thickness in Cu-Al Alloys”, ScriptaMaterialia, 60 (2009) 211-213.

10. Y.S. Li, Y. Zhang, N.R. Tao, K. Lu, “Effect of the Zener-Hollomon Parameter on the Microstructures and Mechanical Properties of Cu Subjected to Plastic Deformation”, ActaMaterialia, 57 (2009) 761-772.

11. Y.S. Li, Y. Zhang, N.R. Tao, K. Lu, “Effect of Thermal Annealing on Mechanical Properties of a Nanostructured Copper Prepared by means of Dynamic Plastic Deformation”, ScriptaMaterialia, 59 (2008) 475-478.

12. Y. Zhang, N.R. Tao, K. Lu, “Mechanical Properties and Rolling Behaviors of Nano-grained Copper with Embedded Nano-twin Bundles”, ActaMaterialia, 56 (2008) 2429-2440.

13. Y. Zhang, Y.S. Li, N.R. Tao, K. Lu, “High Strength and High Electrical Conductivity in Bulk Nanograined Cu Embedded with Nanoscale Twins”, Applied Physics Letters, 91 (2007) 211901.